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VACUUM DEPOSITION TECHNOLOGY
High performance deposition system is based on DC magnetron sputtering
devices.
Various usages that require films and coatings with special electrical,
mechanical, magnetic and optic properties with a high adhesion of
deposited film to the substrate.
- Arch configuration of magnetic field provides by system of permanent
magnets or by adjustable electromagnet
- A variety of a target configurations (cylindrical and planar),
different target sizes and materials are available
- Discharge current is up to 10 A
- Discharge voltage is in the range 400-800 V
- Deposition rate ~ 100 nanometers per minute
- Investigations of Plasma-Target Interactions Processes
- Investigations of Plasma Behavior in DC discharge with crossed
magnetic and electric fields
- R&D works of DC magnetron sputtering systems
- Production of DC magnetron system at the customer's request
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| Magnetron sputtering unit |
Different sizes |
Unballanced mode of magnetron |
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"POTOK"
Simulation Code
This program calculates the deposition rate and spatial distribution
of sputtered atoms for different conditions of magnetron sputtering
system under a wide gas pressure range. The thermolization
process and diffusion on atoms of the working gas are included
in estimations.
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